Recent advances in optical technologies for data centers: a review
There have been considerable advances in high-bandwidth pluggable optical interconnects for the data center. Large-scale data
Price list for low-temperature resistant active optical components for data center interconnects
Low-temperature resistant active optical modules and cables for DCI range from $1,400 for short-reach 400G modules to over $130,000 for long-haul coherent ZR+ modules, with liquid-cooled and immersion-cooled AOCs enhancing performance and energy efficiency.
Pricing Overview
- 400G QSFP-DD SR8 Modules: Short-reach in-rack or cross-row connections typically cost $1,400–$1,800 from reputable third-party vendors, making them the standard entry point for high-speed DCI deployments .
- Long-Haul Coherent ZR+ Modules: Designed for extended DCI links, OEM prices can exceed $130,000, reflecting advanced optics and long-distance capabilities .
- 10G–200G Liquid-Cooled Modules and AOCs: FiberMall offers liquid-cooled optical modules and AOCs for 10G, 25G, 100G, 200G, 400G, and 800G, reducing operating temperatures by over 30% and improving energy efficiency by up to 40% .
- Immersion Liquid-Cooled AOCs: AscentOptics provides AOCs optimized for immersion cooling environments, ensuring reliable high-speed transmission and thermal management in high-performance computing and AI-driven data centers .
- Low-Loss Active Optical Modules (10G–400G): CSC Energia lists modules with low power consumption (<8.5W, typically 7.5W at 800G), low latency, and high bandwidth density, suitable for AI/ML and HPC networks .
Product Features
- Cooling Technologies: Liquid circulation, immersion cooling, and high-efficiency heat dissipation designs enable stable operation in low-temperature or high-density environments .
- Data Rates and Form Factors: Modules and AOCs support 10G to 800G, with QSFP28, QSFP112, OSFP, and SFP56 form factors for flexible deployment .
- Energy Efficiency: Liquid-cooled solutions reduce overall data center energy consumption and improve Power Usage Effectiveness (PUE) by up to 40% .
- Compatibility: Multi-vendor support ensures interoperability with Cisco, Huawei, Juniper, Arista, NVIDIA/Mellanox, Intel, Dell, HPE Aruba, and other enterprise networking equipment .
Considerations for Procurement
- Transmission Distance: Prices vary significantly depending on short-reach vs. long-haul requirements.
- Volume Discounts: Many vendors offer tiered pricing for bulk purchases, which can substantially reduce TCO .
- Application Needs: AI/ML, HPC, and cloud data centers may require high-density, low-latency, and low-power modules.
- Cooling Requirements: Liquid-cooled or immersion-cooled modules are recommended for high-power, high-density racks to maintain reliability and extend component lifespan . For detailed procurement, it is advisable to consult vendor-specific price lists and request quotes based on data rate, reach, cooling technology, and form factor to optimize cost and performance for your data center interconnect needs.
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